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  tlp721(d4,m)series,tlp733(d4,m)series,tlp747(d4,m)series 2001-05-14 1 toshiba photocoupler tlp721(d4,m)series,tlp733(d4,m)series,tlp747(d4,m)series attachment : specifications for vde0884 option: (d4) types : tlp721, tlp721f, tlp733, tlp733f, tlp734, tlp734f, tlp747g, tlp747gf, tlp747j, tlp747jf this data sheet refers to black mold-resin devices, tlpxxx (d4xxx, m) that previously has a white-resin mold and have been changed. when designing new products please use black mold-resin devices. type designations for 'option: (d4) ', which are tested under vde0884 requirements. ex. : tlp734f (d4-gr-lf4, m) d4 : vde0884 option gr : ctr rank name lf4 : standard lead bend name m : black mold-resin devices note : use toshiba standard type number for safety standard application. ex. tlp734(fd4-gr-lf4, m) tlp734f vde0884 isolation characteristics description symbol rating unit application classification (din vde0110 teil 2 / 01.89, table 1) for rated mains voltage 300 v rms for rated mains voltage 600 v rms i- iv i- iii D climatic classification (din iec68 teil 1 / 09.80) 40 / 100 / 21 D pollution degree (din vde0110 teil 2 / 01.89) 2 D tlpxxx type 890 maximum operating insulation voltage tlpxxxf type v iorm 1130 vpk tlpxxx type 1335 input to output test voltage, method a vpr = 1.5 v iorm , type and sample test tp = 60s, partial discharge < 5pc tlpxxxf type vpr 1695 vpk tlpxxx type 1670 input to output test voltage, method b vpr = 1.875 v iorm , 100% production test tp = 1s, partial discharge < 5pc tlpxxxf type vpr 2120 vpk highest permissible overvoltage (transient overvoltage, t pr = 10s) v tr 8000 vpk safety limiting values (max. permissible ratings in case of fault, also refer to thermal derating curve) current (input current i f , psi = 0) power (output or total powr dissipation) temperature isi psi tsi 400 700 150 ma mw  c insulation resistance, v io = 500v, ta = 25  c v io = 500v, ta = tsi rsi 10 12 10 9 ?
tlp721(d4,m)series,tlp733(d4,m)series,tlp747(d4,m)series 2001-05-14 2 insulation related specifications 7.62mm pitch tlpxxx type 10.16mm pitch tlpxxxf type minimum creepage distance (*) cr 7.0 mm 8.0 mm minimun clearance (*) cl 7.0 mm 8.0 mm minimum insulation thickness ti 0.5 mm comperative tracking index (din iec112 / vde0303, part 1) cti 175 (vde0110 teil 2 / 01.89 group iiia) *: in accordance with din vde0110 teil 1 / 01.89, table 2, & 4 1. if a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value (e. g. at a standard distance between soldering eye centres of 7.5mm). if this is not permissible, the user shall take suitable measures. 2. this photocoupler is suitable for 'safe electrical isolation' only within the safety limit data. maintenance of the safety data shall be ensured by means of protective circuits. tlp721 series tlp733 series tlp747 series
tlp721(d4,m)series,tlp733(d4,m)series,tlp747(d4,m)series 2001-05-14 3 figure 2 partial discharge measurement procedure according to vde0884 non-destructive test for 100% inspection. figure 3 dependency of maximum safety ratings on ambient temperature figure 1 partial discharge measurement procedure according to vde0884 destructive test for qualification and sampling tests.
tlp721(d4,m)series,tlp733(d4,m)series,tlp747(d4,m)series 2001-05-14 4  toshiba is continually working to improve the quality and reliability of its products. nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. it is the responsibility of the buyer, when utilizing toshiba products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such toshiba products could cause loss of human life, bodily injury or damage to property. in developing your designs, please ensure that toshiba products are used within specified operating ranges as set forth in the most recent toshiba products specifications. also, please keep in mind the precautions and conditions set forth in the ?handling guide for semiconductor devices,? or ?toshiba semiconductor reliability handbook? etc..  the toshiba products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). these toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (?unintended usage?). unintended usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. unintended usage of toshiba products listed in this document shall be made at the customer?s own risk.  gallium arsenide (gaas) is a substance used in the products described in this document. gaas dust and fumes are toxic. do not break, cut or pulverize the product, or use chemicals to dissolve them. when disposing of the products, follow the appropriate regulations. do not dispose of the products with other industrial waste or with domestic garbage.  the products described in this document are subject to the foreign exchange and foreign trade laws.  the information contained herein is presented only as a guide for the applications of our products. no responsibility is assumed by toshiba corporation for any infringements of intellectual property or other rights of the third parties which may result from its use. no license is granted by implication or otherwise under any intellectual property or other rights of toshiba corporation or others.  the information contained herein is subject to change without notice. 000707ebc restrictions on product use


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